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  3. FM 377U (.055PSF) - 350 Degree Adhesive Film Cytec
FM 377U (.055PSF) - 350 Degree Adhesive Film Cytec image 1

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FM 377U (.055PSF) - 350 Degree Adhesive Film Cytec

FM 377U (.055PSF)

Adhesive Films

Details & Compliance

FALSE
lead time

Lead Time: 2-4 Weeks

Description

FM® 377U .055 is a 350°F (177°C) cure, unsupported modified epoxy film adhesive originally developed by Cytec and now supplied under Solvay/Syensqo. It is designed for demanding aerospace structural bonding applications and provides continuous service capability at 350°F (177°C). The unsupported film is suitable for bonding metallic, non-metallic and sandwich structures, as well as for co-cure and secondary bonding of composite structures. It can also be easily reticulated on honeycomb core or perforated metal for applications such as nacelle bonding.

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