Henkel
LOCTITE ECCOBOND FP4531 - One-part, epoxy-based underfill encapsulant
LOCTITE ECCOBOND FP4531
Adhesives
Details & Compliance
FALSE
lead time
Lead Time: 2-4 Weeks
Description
LOCTITE® ECCOBOND FP4531 is a one-component, epoxy-based capillary underfill encapsulant developed for flip-chip-on-flex electronic assemblies. It flows into very small gaps through capillary action and provides mechanical reinforcement of the solder interconnections after curing. Henkel specifies compatibility with gaps down to 1 mm (0.04 in) on its current product page.