MISC
Sn99.3Cu0.7 - Solder
Sn99.3Cu0.7
Adhesives
Details & Compliance
FALSE
lead time
Lead Time: 2-4 Weeks
Description
Sn99.3Cu0.7 is a lead-free solder alloy composed of 99.3% tin and 0.7% copper by weight. It is used for soldering electrical and electronic connections, joining compatible metal components and assembling circuit boards. The alloy offers good electrical conductivity and is suitable for applications requiring lead-free soldering. Processing temperature and compatibility depend on the soldering method and component materials.